Particle atomic layer deposition

Abstract

The functionalization of fine primary particles by atomic layer deposition (particle ALD) provides for nearly perfect nanothick films to be deposited conformally on both external and internal particle surfaces, including nanoparticle surfaces. Film thickness is easily controlled from several angstroms to nanometers by the number of self-limiting surface reactions that are carried out sequentially. Films can be continuous or semi-continuous. This review starts with a short early history of particle ALD. The discussion includes agitated reactor processing, both atomic and molecular layer deposition (MLD), coating of both inorganic and polymer particles, nanoparticles, and nanotubes. A number of applications are presented, and a path forward, including likely near-term commercial products, is given.

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